Title :
Thermal impedance of ceramic packages using beam-lead IC chips
fDate :
2/1/1969 12:00:00 AM
Keywords :
Ceramics; Computer graphics; Dielectric breakdown; Dielectric losses; Impedance; Integrated circuit packaging; Silicon; Substrates; Surface resistance; Thermal resistance;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1969.16675
