DocumentCode
1035774
Title
A Finite-Element-Based Methodology for Evaluating Solder Electromigration Current Limits of Sn/Pb Eutectic Solder Bumps
Author
Dauksher, Walter ; Eaton, Dennis H. ; Rowatt, James D.
Author_Institution
ASIC Products Group, Fort Collins
Volume
8
Issue
1
fYear
2008
fDate
3/1/2008 12:00:00 AM
Firstpage
222
Lastpage
228
Abstract
This paper investigates the effect of current distribution to the bump and current crowding on the electromigration (EM) of Sn/Pb eutectic solder bumps. The peak current density in the bump is found to have a significant effect on the EM lifetime of the tested structures and, thus, impacts the maximum allowable bump current. A finite-element model is developed which accurately predicts the maximum allowable bump current as a function of the current crowding. This model makes it possible to predict the maximum bump current for a new current-distribution scheme based on results from EM tests on an existing current- distribution scheme.
Keywords
current distribution; electromigration; eutectic alloys; finite element analysis; reliability; solders; tin alloys; EM lifetime; Sn-Pb; current-distribution scheme; eutectic solder bump; finite-element-based methodology; solder electromigration current evaluation; Electromigration (EM); electromigration; finite element; solder;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2008.915626
Filename
4431865
Link To Document