A high-density heat-sink-mounted inductor for automotive applications

Author

Gerber, Mark ; Ferreira, Jan Abraham ; Hofsajer, Ivan W. ; Seliger, Norbert

Author_Institution

Fac. of Electr. Eng., Delft Tech. Univ., Netherlands

Volume

40

Issue

4

fYear

2004

Firstpage

1031

Lastpage

1038

Abstract

Passive components, and inductors, in particular, contribute greatly to the overall volume of power electronic converters. These components are normally packaged individually with little concern for the overall system. For high-density switching power supplies it is imperative to minimize the volume to as great an extent as possible which implies that the passive component volume usage needs to be improved. This can be accomplished by applying suitable packaging and cooling techniques to these components. In this paper, two inductor structures finding application in a 2.1-kW synchronous automotive converter are described. The air-gap placement, losses, cooling methods, and thermal profiles are analyzed and verified experimentally with an inductor designed for operation at 85°C ambient.

Keywords

air gaps; automotive electronics; cooling; heat sinks; inductors; switched mode power supplies; switching convertors; thermal management (packaging); 2.1 kW; 85 degC; air-gap placement; automotive; cooling technique; high-density heat-sink-mounted inductor; packaging technique; power electronic converters; switching power supplies; synchronous automotive converter; thermal profiles; Air gaps; Automotive applications; Cooling; Inductors; Industry Applications Society; Packaging; Power electronics; Surface resistance; Temperature; Thermal resistance; Direct heat removal; high power density; high temperature; indirect heat removal; packaging; passive component;

fLanguage

English

Journal_Title

Industry Applications, IEEE Transactions on

Publisher

ieee

ISSN

0093-9994

Type

jour

DOI

10.1109/TIA.2004.830766

Filename

1315795