DocumentCode :
1037948
Title :
GaInAs junction FET fully dry etched by metal organic reactive ion etching technique
Author :
Lecrosnier, D. ; Henry, Leanne ; Le Corre, A. ; Vaudry, C.
Author_Institution :
CNET, Lannion, France
Volume :
23
Issue :
24
fYear :
1987
Firstpage :
1254
Lastpage :
1255
Abstract :
The metal organic reactive ion etching technique, which uses a mixture of methane, hydrogen and argon, has been applied for the first time to the fabrication of a device. This etching technique is used to define the gate of a GaInAs junction FET. Results shows that it permits good control of etching depth with low surface damage.
Keywords :
III-V semiconductors; gallium arsenide; indium compounds; junction gate field effect transistors; sputter etching; GaInAs junction FET; JFET; MORIE; control of etching depth; metal organic reactive ion etching; methane Ar-H2 etching gas mixture; surface damage;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19870871
Filename :
4259112
Link To Document :
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