Title :
Crosstalk test pattern generation for dynamic programmable logic arrays
Author :
Liu, Jianxun ; Jone, Wen-Ben ; Das, Sunil R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Cincinnati, OH
Abstract :
Crosstalk noise is one of the major noise problems introduced by interconnect wire scaling and high clock speed. In modern deep submicrometer circuits (DSM), signal crosstalk can arise between two long parallel wires. Programmable logic arrays (PLAs) are important building blocks in digital very large scale integrated (VLSI) circuits; especially, dynamic PLAs have been used pervasively in modern high-speed circuit design because of their predictable delays. However, a dynamic PLA may suffer crosstalk noises that will cause the circuit to malfunction due to charge loss. In this paper, based on the characteristics of dynamic PLA crosstalk noise, an automatic test pattern generation (ATPG) method to detect the maximum crosstalk noise for each product line is presented. Test patterns are then compressed by a test pattern compressor. Experimental results obtained by simulating Microelectronics Center of North Carolina (MCNC) PLA benchmark circuits demonstrate the efficiency of the ATPG and test compression methods
Keywords :
automatic test pattern generation; crosstalk; integrated circuit noise; logic testing; programmable logic arrays; ATPG method; VLSI circuits; automatic test pattern generation method; crosstalk noise; crosstalk test pattern generation; deep submicrometer circuits; dynamic PLA; dynamic programmable logic arrays; high clock speed; interconnect wire scaling; signal crosstalk; test compression methods; test pattern compressor; very large scale integrated circuits; Automatic test pattern generation; Circuit testing; Clocks; Crosstalk; Integrated circuit interconnections; Logic testing; Programmable logic arrays; Test pattern generators; Very large scale integration; Wire; Automatic test pattern generation (ATPG); crosstalk noise; dynamic programmable logic array (PLA); signal integrity; test compression;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.2006.877721