• DocumentCode
    1039116
  • Title

    The study of buffer structure of on-board test´s circuit module in high shock

  • Author

    Peng, Xu ; Jing, Zu ; Zu-Seng, Lin

  • Author_Institution
    Sci. Dept., North China Inst. of Technol., Shanxi, China
  • Volume
    53
  • Issue
    4
  • fYear
    2004
  • Firstpage
    1224
  • Lastpage
    1226
  • Abstract
    In order to measure the acceleration of a projectile penetrating hard aims, we adopt on-board test technology. When the projectile penetrates hard targets, such as concrete, rock, and metal targets, the on-board test´s circuit module suffers very high shock. After having analyzed related technology references, and compared different kinds of buffer materials and structures, we performed some experiments, then drew the conclusion that it is a valid method to use nonlinear buffer structures, such as plastic springs, to absorb the energy of the on-board test circuit module in the process of the buffer structure´s compressive collapse.
  • Keywords
    acceleration measurement; circuit testing; projectiles; shock measurement; buffer structure; nonlinear buffer structures; on-board test circuit module; on-board test technology; plastic springs; Accelerometers; Building materials; Circuit testing; Concrete; Electric shock; Life estimation; Performance analysis; Performance evaluation; Plastics; Projectiles; Acceleration; buffer structure; circuit module; high shock; on-board test;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2004.830566
  • Filename
    1316009