DocumentCode
1039116
Title
The study of buffer structure of on-board test´s circuit module in high shock
Author
Peng, Xu ; Jing, Zu ; Zu-Seng, Lin
Author_Institution
Sci. Dept., North China Inst. of Technol., Shanxi, China
Volume
53
Issue
4
fYear
2004
Firstpage
1224
Lastpage
1226
Abstract
In order to measure the acceleration of a projectile penetrating hard aims, we adopt on-board test technology. When the projectile penetrates hard targets, such as concrete, rock, and metal targets, the on-board test´s circuit module suffers very high shock. After having analyzed related technology references, and compared different kinds of buffer materials and structures, we performed some experiments, then drew the conclusion that it is a valid method to use nonlinear buffer structures, such as plastic springs, to absorb the energy of the on-board test circuit module in the process of the buffer structure´s compressive collapse.
Keywords
acceleration measurement; circuit testing; projectiles; shock measurement; buffer structure; nonlinear buffer structures; on-board test circuit module; on-board test technology; plastic springs; Accelerometers; Building materials; Circuit testing; Concrete; Electric shock; Life estimation; Performance analysis; Performance evaluation; Plastics; Projectiles; Acceleration; buffer structure; circuit module; high shock; on-board test;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2004.830566
Filename
1316009
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