DocumentCode :
1039116
Title :
The study of buffer structure of on-board test´s circuit module in high shock
Author :
Peng, Xu ; Jing, Zu ; Zu-Seng, Lin
Author_Institution :
Sci. Dept., North China Inst. of Technol., Shanxi, China
Volume :
53
Issue :
4
fYear :
2004
Firstpage :
1224
Lastpage :
1226
Abstract :
In order to measure the acceleration of a projectile penetrating hard aims, we adopt on-board test technology. When the projectile penetrates hard targets, such as concrete, rock, and metal targets, the on-board test´s circuit module suffers very high shock. After having analyzed related technology references, and compared different kinds of buffer materials and structures, we performed some experiments, then drew the conclusion that it is a valid method to use nonlinear buffer structures, such as plastic springs, to absorb the energy of the on-board test circuit module in the process of the buffer structure´s compressive collapse.
Keywords :
acceleration measurement; circuit testing; projectiles; shock measurement; buffer structure; nonlinear buffer structures; on-board test circuit module; on-board test technology; plastic springs; Accelerometers; Building materials; Circuit testing; Concrete; Electric shock; Life estimation; Performance analysis; Performance evaluation; Plastics; Projectiles; Acceleration; buffer structure; circuit module; high shock; on-board test;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.2004.830566
Filename :
1316009
Link To Document :
بازگشت