DocumentCode
1039117
Title
Thermal instability in very small p-n junctions
Author
Chiang, K.L. ; Lauritzen, Peter O.
Author_Institution
Fairchild Semiconductor, Palo Alto, Calif.
Volume
17
Issue
9
fYear
1970
fDate
9/1/1970 12:00:00 AM
Firstpage
782
Lastpage
787
Abstract
Thermally induced second breakdown is studied in very small 6- to 10-volt silicon diodes having uniform breakdown. The formation of a small high-current density region is observed optically at the onset of thermal breakdown. Incremental resistance measurements can be used to determine nondestructively the threshold current for thermal breakdown. The threshold temperature for thermal breakdown is measured using the avalanche voltage temperature coefficient. The voltage drop associated with thermal breakdown is shown to be due to a sudden change in active area of the junction rather than to melting of the crystal.
Keywords
Avalanche breakdown; Breakdown voltage; Diodes; Electric breakdown; Electrical resistance measurement; P-n junctions; Silicon; Temperature; Thermal resistance; Threshold current;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1970.17073
Filename
1476257
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