• DocumentCode
    1039140
  • Title

    Estimating fatigue lifetime of power-cycled solid-state switches

  • Author

    Pankratz, J.M. ; Plumlee, H.R.

  • Volume
    17
  • Issue
    9
  • fYear
    1970
  • fDate
    9/1/1970 12:00:00 AM
  • Firstpage
    793
  • Lastpage
    797
  • Abstract
    A description is given of a method for estimating the fatigue lifetime of a solid-state power switch. The switch considered is a layered structure with a silicon wafer as a power-dissipating structure from which heat flows through a solder layer into a copper heat sink. Lifetime data and metallographic analyses are presented for devices operating at 80-, 60-, and 40-amperes rms with fatigue lifetimes in excess of 106cycles. The data are in substantial agreement with the theory.
  • Keywords
    Copper; Fatigue; Heat sinks; Life estimation; Lifetime estimation; Silicon; Solid state circuits; Switches; Temperature distribution; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1970.17075
  • Filename
    1476259
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1039140