DocumentCode :
103975
Title :
Low RC-Constant Perforated-Channel HFET
Author :
Simin, Grigory S. ; Islam, Mohammad ; Gaevski, M. ; Deng, Jiansong ; Gaska, R. ; Shur, Michael S.
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
Volume :
35
Issue :
4
fYear :
2014
fDate :
Apr-14
Firstpage :
449
Lastpage :
451
Abstract :
The novel HFET design using perforated channel region under the gate reduces drain and source parasitic resistances due to the current spreading effect in the source-gate and gate-drain regions. Demonstrated results for AlGaN/GaN HFET show that the RONCG time constant reduces around two times using simple and robust perforated channel device processing. These results are especially important for new generations of power switching transistors.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; power semiconductor switches; wide band gap semiconductors; AlGaN-GaN; HFET design; current spreading effect; drain parasitic resistance; gate-drain region; perforated channel region; power switching transistors; source parasitic resistance; source-gate region; Aluminum gallium nitride; Capacitance; Gallium nitride; HEMTs; Logic gates; MODFETs; AlGaN/GaN; HEMT; HFET; power switch;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2304726
Filename :
6740828
Link To Document :
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