• DocumentCode
    1040149
  • Title

    A Novel Bistable Two-Way Actuated Out-of-Plane Electrothermal Microbridge

  • Author

    Michael, Aron ; Kwok, Chee Yee ; Yu, Kevin ; Mackenzie, Mark R.

  • Author_Institution
    New South Wales Univ., Sydney
  • Volume
    17
  • Issue
    1
  • fYear
    2008
  • Firstpage
    58
  • Lastpage
    69
  • Abstract
    In this paper, we report the design, simulation, fabrication, and testing of a novel electrothermally actuated buckled microbridge for out-of-plane actuation. The new structure consists of a bridge supported by two springs and two "legs" at both supporting ends. The bridge and the spring are trilayer structures: low-stress plasma-enhanced chemical-vapor-deposition (PECVD) oxide (2.5 mum), high compressive stress PECVD oxide (1 mum), and phosphorus-doped silicon (2 mum). The "legs" consist only of 2-mum-thick phosphorus-doped silicon. The overall size of the actuator is 1200 mum by 100 mum excluding the contact pads. Analytical expressions used to determine torsional and axial stiffnesses at the supporting ends are derived. Together with bistability criteria developed by Michael and Kwok, the microbridge structure is designed to exhibit a bistable behavior. It is also designed to have a two-way actuation capability. Electrothermal analysis and thermomechanical finite element ANSYS simulations are performed to determine the switching waveforms for the two-way actuation and verify the bistability. Actuation of the fabricated structure from the buckled-up to the buckled-down states required a 7-V voltage pulse for 1 ms across the "legs," followed by a 5-V pulse for 4 ms across the bridge. A 9-V pulse for 0.5 ms only to "legs" enabled the switching of the bridge from the buckled-down to the buckled-up states. An out-of-plane movement of 31 mum is demonstrated for a 1200-mum-long microbridge. Larger movement can be obtained by increasing the microbridge length and the compressive stress of the stressed oxide layer of the bridge.
  • Keywords
    bridges (structures); chemical vapour deposition; doping; elastic constants; finite element analysis; microactuators; silicon; springs (mechanical); axial stiffness; bistable two-way out-of-plane actuation; compressive stress; distance 1200 mum; electrothermally actuated buckled microbridge; low-stress PECVD; plasma-enhanced chemical-vapor-deposition; size 2 mum; springs; thermomechanical finite element ANSYS simulation; time 0.5 ms; time 1 ms; time 4 ms; torsional stiffness; voltage 5 V; voltage 7 V; voltage 9 V; Bistable; electrothermal; microbridge; out-of-plane actuation;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2007.911369
  • Filename
    4435065