DocumentCode :
1041267
Title :
Effects of process parameter distributions and ion strike locations on SEU cross-section data [CMOS SRAMs]
Author :
Massengill, L.W. ; Alles, M.L. ; Kerns, S.E. ; Jones, K.L.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
Volume :
40
Issue :
6
fYear :
1993
fDate :
12/1/1993 12:00:00 AM
Firstpage :
1804
Lastpage :
1811
Abstract :
The effect of statistical parameter distributions and stochastic ion strike locations in hardened memory arrays on observed SEU (single event upset) cross-section data is discussed. Application of numerical analysis to the parasitic bipolar gain distributions in SIMOX (separation by implantation of oxygen) SRAMs (static random-access memories) and the introduction of an effective critical charge based on sensitivities to ion strike locations explain the nonsaturating behavior of measured cross-section curves in SOI (silicon-on-insulator) and other hardened memories. A direct, analytical relationship between the measured cross-section curves seen in contemporary SOI CMOS SRAMs and the distribution of the parasitic bipolar β values controlling each cell critical charge is presented. Results of this technique clearly indicate that distributed processing parameters and random ion strike locations lead to nonideal cross-section curves. The results also indicate that if the distribution for a critical parameter is known, the LET (linear energy transfer) threshold and shape of the upset cross-section curves can be anticipated
Keywords :
CMOS integrated circuits; SIMOX; SPICE; SRAM chips; integrated circuit testing; ion beam effects; radiation hardening (electronics); LET threshold; SEU cross-section data; SIMOX SRAMs; SOI CMOS SRAMs; SPICE simulation; effective critical charge; hardened memory arrays; linear energy transfer; numerical analysis; parasitic bipolar gain distributions; process parameter distributions; statistical parameter distributions; stochastic ion strike locations; upset cross-section curves; Charge measurement; Current measurement; Distributed processing; Energy exchange; Gain measurement; Numerical analysis; Shape; Silicon on insulator technology; Single event upset; Stochastic processes;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.273476
Filename :
273476
Link To Document :
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