DocumentCode
1041751
Title
Analysis of thermal impedance for conventional and beam lead IC chips
Author
Ebrahimi, J.
Author_Institution
Bell Northern Research, Ottawa, Ont., Canada
Volume
18
Issue
12
fYear
1971
fDate
12/1/1971 12:00:00 AM
Firstpage
1139
Lastpage
1146
Abstract
The thermal impedance of conventional and beam lead IC packages is evaluated from the partial differential equations, which govern the temperature and heat flow within the chip and substrate, and transmission line analogy. The mounting and the geometry dependance of the thermal impedance for various heat sink and chip sizes are presented for both beam lead and conventional IC packages. The variation of thermal impedance with the number of leads and the various Ceramic sizes is shown for the beam lead IC chip.The lumped and the distributed heat sources have been considered for the different mounting structures.
Keywords
Analog integrated circuits; Ceramics; Equations; Geometry; Heat sinks; Impedance; Integrated circuit packaging; Power transmission lines; Substrates; Temperature sensors;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1971.17344
Filename
1476666
Link To Document