Title :
Unexpected increase in the thermal generation rate of bulk GaAs due to electron-beam metallization
Author :
Mayer, T. Stellwag ; Fleetwood, D.M. ; Beutler, D.E. ; Cooper, J.A., Jr. ; Melloch, M.R.
Author_Institution :
Sch. of Electr. Eng., Purdue Univ., W. Lafayette, IN, USA
fDate :
12/1/1993 12:00:00 AM
Abstract :
It is demonstrated that the thermal generation rate in the bulk depletion regions of GaAs p-n junctions of samples metallized in e-beam evaporators can be as much as three-orders-of-magnitude greater than those metallized in thermal evaporators. This degradation is unexpected because the low-energy radiation present in such e-beam evaporation systems is unable to cause the atomic displacement responsible for defect creation in GaAs. Results derived from samples metallized in the e-beam evaporator indicate, however, that low-energy electrons are somehow involved in the formation of the defects responsible for the increased generation rate. Experiments performed in controlled-radiation environments have demonstrated clearly that simple radiation damage either from electrons or from X-rays is insufficient to degrade these GaAs devices. The simple diffusion of impurity ions in the absence of a high fluence of a low-energy electrons is also insufficient. Therefore, the experimental results suggest a damage mechanism in which the presence of both low-energy electrons and impurity ions is necessary to cause the increase in generation rates observed in bulk GaAs
Keywords :
III-V semiconductors; Schottky gate field effect transistors; electron beam deposition; electron beam effects; gallium arsenide; metallisation; semiconductor device testing; III-V semiconductors; MESFET; bulk GaAs; defect creation; electron-beam metallization; impurity ions; low-energy electrons; p-n junctions; radiation damage; thermal generation rate; Atomic measurements; Electrons; Fabrication; Gallium arsenide; Impurities; Metallization; P-n junctions; Thermal degradation; Thermal engineering; X-rays;
Journal_Title :
Nuclear Science, IEEE Transactions on