Title :
Fabrication of thin-film multilayer substrate using copper clad polyimide sheets
Author :
Miura, Osamu ; Miyazaki, Kunio ; Takahashi, Akio ; Watanabe, Ryuji ; Miwa, Takao
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
fDate :
12/1/1993 12:00:00 AM
Abstract :
A fabrication process is proposed for thin-film multilayer substrates. The process involves the lamination of polyimide sheets with previously inspected wiring patterns. Several technical points were investigated during development. Fairly large dimensional changes occur in the polyimide sheets in the copper etching and lamination steps. However, these changes can be restrained by fixing the sheets to rigid frames. Excimer laser ablation is a useful method for forming blind via holes with a high aspect ratio. These holes can be metallized successfully by electroless copper plating
Keywords :
copper; electroless deposition; etching; laminates; laser ablation; polymer films; printed circuit manufacture; substrates; Cu; Cu clad polyimide sheets; Cu etching; blind via holes; electroless Cu plating; excimer laser ablation; fabrication process; high aspect ratio; lamination; thin-film multilayer substrate; wiring patterns; Copper; Etching; Fabrication; Lamination; Laser ablation; Nonhomogeneous media; Polyimides; Substrates; Transistors; Wiring;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
