DocumentCode :
1042873
Title :
Electrical, structural and processing properties of electrically conductive adhesives
Author :
Li, Li ; Lizzul, Christine ; Kim, Hansoo ; Sacolick, Isaac ; Morris, James E.
Author_Institution :
Dept. of Electr. Eng., Binghamton Univ., NY, USA
Volume :
16
Issue :
8
fYear :
1993
fDate :
12/1/1993 12:00:00 AM
Firstpage :
843
Lastpage :
851
Abstract :
There is growing interest in the potential of electrically conductive metal-loaded polymer adhesives. Eight commercial electrically conductive adhesive pastes for solder replacement in surface mount technology (SMT) and other microelectronic applications were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite. The properties on which this work was focused were the microstructure and electrical characteristics, with the specific purpose of determining the conduction mechanisms. The electrical measurements established that the primary source of electrical resistance is in the silver particles, with negligible contact effects between them. Differential scanning calorimetry results indicated that drifts in the electrical properties are not attributable to incomplete cures. Electrical measurements on simplified structures prepared in the laboratory are also reported
Keywords :
adhesion; conducting polymers; electrical conductivity of solids; filled polymers; microassembling; nickel; percolation; silver; surface mount technology; thermal analysis; Ag; Ag particles; Ag-polymer composite; Ni; Ni-polymer composite; SMT; adhesive pastes; conduction mechanisms; differential scanning calorimetry; electrical characteristics; electrical resistance; electrically conductive adhesives; metal-loaded polymer adhesives; microelectronic applications; microstructure; processing properties; solder replacement; structural properties; surface mount technology; thermoplastic type; thermosetting type; Conductive adhesives; Electric potential; Electric variables measurement; Electrical resistance measurement; Mechanical factors; Microelectronics; Microstructure; Polymers; Silver; Surface-mount technology;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.273683
Filename :
273683
Link To Document :
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