DocumentCode
1042873
Title
Electrical, structural and processing properties of electrically conductive adhesives
Author
Li, Li ; Lizzul, Christine ; Kim, Hansoo ; Sacolick, Isaac ; Morris, James E.
Author_Institution
Dept. of Electr. Eng., Binghamton Univ., NY, USA
Volume
16
Issue
8
fYear
1993
fDate
12/1/1993 12:00:00 AM
Firstpage
843
Lastpage
851
Abstract
There is growing interest in the potential of electrically conductive metal-loaded polymer adhesives. Eight commercial electrically conductive adhesive pastes for solder replacement in surface mount technology (SMT) and other microelectronic applications were selected for study, including both thermosetting and thermoplastic examples. All were silver based, except for one nickel-polymer composite. The properties on which this work was focused were the microstructure and electrical characteristics, with the specific purpose of determining the conduction mechanisms. The electrical measurements established that the primary source of electrical resistance is in the silver particles, with negligible contact effects between them. Differential scanning calorimetry results indicated that drifts in the electrical properties are not attributable to incomplete cures. Electrical measurements on simplified structures prepared in the laboratory are also reported
Keywords
adhesion; conducting polymers; electrical conductivity of solids; filled polymers; microassembling; nickel; percolation; silver; surface mount technology; thermal analysis; Ag; Ag particles; Ag-polymer composite; Ni; Ni-polymer composite; SMT; adhesive pastes; conduction mechanisms; differential scanning calorimetry; electrical characteristics; electrical resistance; electrically conductive adhesives; metal-loaded polymer adhesives; microelectronic applications; microstructure; processing properties; solder replacement; structural properties; surface mount technology; thermoplastic type; thermosetting type; Conductive adhesives; Electric potential; Electric variables measurement; Electrical resistance measurement; Mechanical factors; Microelectronics; Microstructure; Polymers; Silver; Surface-mount technology;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.273683
Filename
273683
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