DocumentCode
1042891
Title
Encapsulants used in flip-chip packages
Author
Suryanarayana, Darbha ; Wu, Tien Y. ; Varcoe, Jack A.
Author_Institution
Microelectron. Div., IBM Corp., Endicott, NY, USA
Volume
16
Issue
8
fYear
1993
fDate
12/1/1993 12:00:00 AM
Firstpage
858
Lastpage
862
Abstract
A systematic approach to quantifying the viscosity and flow coverage, thermal expansion, modulus, glass transition temperature, filler size, alpha activity, adhesion, ionics content, fracture toughness, and electrical properties of low-thermal-expansion encapsulants is presented. The various test methods and their relevant technical aspects are discussed. Results achieved on a few selected materials are presented as examples
Keywords
adhesion; encapsulation; flip-chip devices; fracture toughness; moisture; packaging; thermal expansion; viscosity of liquids; adhesion; alpha activity; electrical properties; filler size; flip-chip packages; flow coverage; fracture toughness; glass transition temperature,; ionics content; low-thermal-expansion encapsulants; modulus; test methods; thermal expansion; viscosity; Adhesives; Bonding; Ceramics; Electronic packaging thermal management; Electronics packaging; Fatigue; Glass; Thermal expansion; Thermal stresses; Viscosity;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.273685
Filename
273685
Link To Document