Development of a cost-effective high-performance metal QFP packaging system

Author

Mabulikar, D. ; Pasqualoni, Anthony ; Crane, Jack ; Braden, Jeffrey S.

Author_Institution

Metals Res. Labs., Olin Corp., New Haven, CT, USA

Volume

16

Issue

8

fYear

1993

fDate

12/1/1993 12:00:00 AM

Firstpage

902

Lastpage

908

Abstract

The design and development of MQUAD technology is described. The MQUAD packaging system is a high-performance, reliable technology currently in use for packaging of microprocessors and high-speed ASIC devices, including CMOS, BiCMOS, bipolar, gallium arsenide, and other high performance ICs. The packaging technology is being used for devices dissipating up to 14 W and switching speeds of up to 300 MHz. The design and development was carried out with the objectives of high thermal performance (up to 15 W); high electrical performance, with inductance and capacitances lower than those of comparable plastic quad flat packs (PQFPs); and reliability superior to that of the PQFPs. The approach taken was to use an adhesively bonded metal package. Reliability tests performed included temperature cycling, thermal shocks, solvent resistance, flammability, pressure cooker, and vapour phase shocks. Electrical characterization included θ_ja and θ _jc and resistance, inductance, and capacitance measurements

Keywords

application specific integrated circuits; circuit reliability; integrated circuit technology; microprocessor chips; packaging; 14 W; 300 MHz; MQUAD technology; adhesively bonded metal package; capacitance measurements; electrical characterization; flammability; high electrical performance; high thermal performance; high-speed ASIC devices; inductance measurements; metal QFP packaging system; microprocessors; pressure cooker; quad flat packs; reliability tests; resistance measurements; solvent resistance; temperature cycling; thermal shock; vapour phase shock; Application specific integrated circuits; BiCMOS integrated circuits; CMOS technology; Capacitance; Electric resistance; Electric shock; Electronics packaging; Gallium arsenide; Microprocessors; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.273691

Filename

273691