DocumentCode
1043074
Title
Anisotropically conductive polymer films with a uniform dispersion of particles
Author
Jin, Sungho ; Tiefel, Thomas H. ; Chen, Li-Han ; Dahringer, Donald W.
Author_Institution
AT&T Bell Labs., Murray Hill, NJ, USA
Volume
16
Issue
8
fYear
1993
fDate
12/1/1993 12:00:00 AM
Firstpage
972
Lastpage
977
Abstract
Anisotropically conductive films consisting of a single layer of magnetically separated conductor spheres in a polymer matrix are described. In a vertical magnetic field, ferromagnetic spheres in a viscous medium become parallel magnetic dipoles and repel one another to produce a uniform, two-dimensional particle distribution. This structure is then frozen in by cooling or curing of the polymer matrix. In order to prevent the formation of undesirable dendritic particle protrusions, the magnetic force on the particles has to be balanced against the surface tension of the polymer and the gravity effect. As an interconnection material placed between circuit devices, the present conductive polymer films with uniformly distributed particles exhibit, as compared to the conventional, random distribution, a reduced tendency for electrical shorts and pad-to-pad variations in contact resistance values especially for fine pitch interconnections. Since the percolation stringers are no longer present in the magnetically distributed structure, it is anticipated that electric-field-induced isolation failures observed in some adhesive films will be substantially diminished
Keywords
adhesion; conducting polymers; filled polymers; magnetic fields; magnetic moments; microassembling; packaging; polymer films; adhesive films; anisotropically conductive films; conductive polymer films; contact resistance values; electric-field-induced isolation failures; ferromagnetic spheres; fine pitch interconnections; interconnection material; magnetically separated conductor spheres; polymer matrix; surface tension; uniform 2D particle distribution; uniform dispersion; vertical magnetic field; Anisotropic magnetoresistance; Conductive films; Cooling; Curing; Integrated circuit interconnections; Magnetic anisotropy; Magnetic fields; Magnetic separation; Perpendicular magnetic anisotropy; Polymer films;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.273699
Filename
273699
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