DocumentCode
1043102
Title
Aluminum conductor failure due to thermal expansion by power pulses
Author
Mimura, Takashi ; Fukuta, Masumi ; Matayoshi, Hirokazu
Author_Institution
Fujitsu Limited, Kobe, Japan
Volume
19
Issue
5
fYear
1972
fDate
5/1/1972 12:00:00 AM
Firstpage
696
Lastpage
697
Abstract
It is found that an aluminum conductor can fail due to a thermal stress caused by periodically applying rectangular power pulses to semiconducting devices that generate heat internally. The mean time to failure due to this process is calculated. The agreement between the calculated values and the experimental data is good.
Keywords
Aluminum; Artificial intelligence; Conducting materials; Conductive films; Conductors; Semiconductivity; Semiconductor films; Temperature; Thermal conductivity; Thermal expansion;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1972.17481
Filename
1476952
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