DocumentCode
1043446
Title
Semiconductor wafer representation for TCAD
Author
Giles, Martin D. ; Boning, Duane S. ; Chin, Goodwin R. ; Dietrich, Walter C., Jr. ; Karasick, M.S. ; Law, Mark E. ; Mozumder, Purnendu K. ; Nackman, Lee R. ; Rajan, V.T. ; Walker, D.M.H. ; Wang, Robert H. ; Wong, Alexander S.
Author_Institution
Michigan Univ., Ann Arbor, MI, USA
Volume
13
Issue
1
fYear
1994
fDate
1/1/1994 12:00:00 AM
Firstpage
82
Lastpage
95
Abstract
This paper describes the Semiconductor Wafer Representation (SWR) for representing and manipulating wafer state during process and device simulation. The goal of the SWR is to provide an object-oriented interface to a collection of functions designed for developing and integrating Technology CAD (TCAD) applications. By providing functions which can be common across many applications, we aim to greatly reduce tool development and integration time. Corporate, vendor, and university TCAD developers have worked together under the auspices of the CAD Framework Initiative to create an architecture and C++ programming interface for an SWR 1.0 draft standard. Here we describe this architecture and the results of creating and using a prototype implementation of the standard both to integrate existing TCAD tools and to develop simple new tools
Keywords
CAD; object-oriented programming; semiconductor device models; semiconductor process modelling; user interfaces; C++ programming interface; SWR 1.0 draft standard; TCAD; architecture; device simulation; object-oriented interface; process simulation; semiconductor wafer representation; technology CAD; wafer state manipulation; wafer state representation; Circuit simulation; Computational modeling; Design automation; Design optimization; Fabrication; Manufacturing processes; Numerical simulation; Object oriented modeling; Process design; Standards development;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.273747
Filename
273747
Link To Document