• DocumentCode
    1043446
  • Title

    Semiconductor wafer representation for TCAD

  • Author

    Giles, Martin D. ; Boning, Duane S. ; Chin, Goodwin R. ; Dietrich, Walter C., Jr. ; Karasick, M.S. ; Law, Mark E. ; Mozumder, Purnendu K. ; Nackman, Lee R. ; Rajan, V.T. ; Walker, D.M.H. ; Wang, Robert H. ; Wong, Alexander S.

  • Author_Institution
    Michigan Univ., Ann Arbor, MI, USA
  • Volume
    13
  • Issue
    1
  • fYear
    1994
  • fDate
    1/1/1994 12:00:00 AM
  • Firstpage
    82
  • Lastpage
    95
  • Abstract
    This paper describes the Semiconductor Wafer Representation (SWR) for representing and manipulating wafer state during process and device simulation. The goal of the SWR is to provide an object-oriented interface to a collection of functions designed for developing and integrating Technology CAD (TCAD) applications. By providing functions which can be common across many applications, we aim to greatly reduce tool development and integration time. Corporate, vendor, and university TCAD developers have worked together under the auspices of the CAD Framework Initiative to create an architecture and C++ programming interface for an SWR 1.0 draft standard. Here we describe this architecture and the results of creating and using a prototype implementation of the standard both to integrate existing TCAD tools and to develop simple new tools
  • Keywords
    CAD; object-oriented programming; semiconductor device models; semiconductor process modelling; user interfaces; C++ programming interface; SWR 1.0 draft standard; TCAD; architecture; device simulation; object-oriented interface; process simulation; semiconductor wafer representation; technology CAD; wafer state manipulation; wafer state representation; Circuit simulation; Computational modeling; Design automation; Design optimization; Fabrication; Manufacturing processes; Numerical simulation; Object oriented modeling; Process design; Standards development;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.273747
  • Filename
    273747