• DocumentCode
    1044637
  • Title

    An Integer-Linear-Programming-Based Routing Algorithm for Flip-Chip Designs

  • Author

    Fang, Jia-Wei ; Hsu, Chin-Hsiung ; Chang, Yao-Wen

  • Author_Institution
    Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
  • Volume
    28
  • Issue
    1
  • fYear
    2009
  • Firstpage
    98
  • Lastpage
    110
  • Abstract
    The flip-chip package provides a high chip-density solution to the demand for more input-output pads of very large scale integration designs. In this paper, we present the first routing algorithm in the literature for the preassignment flip-chip routing problem with a predefined netlist among pads and wire-width and signal-skew considerations. Our algorithm is based on integer linear programming (ILP) and guarantees to find an optimal solution for the addressed problem. It adopts a two-stage technique of global routing followed by detailed routing. In global routing, it first uses three reduction techniques to prune redundant solutions and create a global-routing path for each net. Without loss of the solution optimality, our reduction techniques can further prune the ILP variables (constraints) by 85.5% (98.0%) on average over a recent reduction technique. The detailed routing applies passing-point assignment, net-ordering determination, and X-based gridless routing to complete the routing. Experimental results based on five real industry designs show that our router can achieve 100% routability and the optimal global-routing wirelength, and satisfy all signal-skew constraints, under reasonable central-processing-unit times, whereas recent related work has resulted in much inferior solution quality.
  • Keywords
    VLSI; flip-chip devices; integer programming; linear programming; network routing; X-based gridless routing; flip-chip package; high chip-density solution; integer linear programming; integer-linear-programming-based routing algorithm; net-ordering determination; passing-point assignment; Algorithm design and analysis; Chip scale packaging; Electronics packaging; Energy consumption; Helium; Integer linear programming; Routing; Semiconductor device packaging; Signal design; Very large scale integration; Detailed routing; global routing; layout; physical design;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2008.2009151
  • Filename
    4723647