DocumentCode :
1044935
Title :
Thermal limitations of CW and pulsed silicon TRAPATT diodes
Author :
Chaturvedi, P.K. ; Khokle, W.S.
Author_Institution :
Central Electronics Engineering Research Institute, Pilani, Rajasthan, India
Volume :
20
Issue :
4
fYear :
1973
fDate :
4/1/1973 12:00:00 AM
Firstpage :
353
Lastpage :
362
Abstract :
The power density distribution in the avalanche zone of a TRAPATT-diode is approximated by a rectangular pulse in order to consider it as a source function in the heat equation. Heat generation is considered to be periodic, and the dissipation is taken with a thermal time constant larger than the period. The increase in frequency needs a decrease in depletion width, improving the thermal conduction to the heat sink. The power density needed increases with frequency, thus raising the maximum temperature in the depletion region with frequency. The criteria for the best performance is that the two processes of heat generation and conduction to the heat sink are to be so adjusted as to lead to a mininum rise in temperature. The steady state temperature rise in CW operation comes out to be R_{TH} \\cdot P_{I} \\cdot W_{ASF}/v_{z} \\cdot f , while in the pulsed case this expression is related to the maximum temperature. The maximum temperature allowable in the depletion region should be lower than that required for any failure to occur. Using these criteria the thermal limitations for CW and pulsed operations of the TRAPATT diode have been analyzed.
Keywords :
Current density; Diodes; Frequency; Heat sinks; Plasma density; Plasma devices; Plasma temperature; Silicon; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1973.17655
Filename :
1477312
Link To Document :
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