Title :
Forced convective air cooling from electronic component arrays in a parallel plate channel
Author :
Gan, Y.P. ; Deng, Q.J. ; Ma, C.F. ; Yuan, X.Y. ; Cai, D.Y.
Author_Institution :
Dept. of Thermal Energy Eng., Beijing Polytech. Univ., China
fDate :
6/1/1996 12:00:00 AM
Abstract :
This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas was obtained to correlate the experimental data for air cooling systems design. Arrays of components with one odd-sized module have also been tested. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared to uniform arrangements. Accordingly, temperature sensitive components are suggested to be placed in these locations
Keywords :
arrays; cooling; forced convection; packaging; electronic component array; forced convective air cooling; heat transfer; inline protruding elements; modular configuration; packaging; parallel plate channel; splitter plate; temperature sensitive components; thermal management; Electronic components; Electronic equipment; Electronics cooling; Gallium nitride; Heat transfer; Packaging; Temperature sensors; Testing; Thermal conductivity; Thermal management;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on