DocumentCode
1045056
Title
Forced convective air cooling from electronic component arrays in a parallel plate channel
Author
Gan, Y.P. ; Deng, Q.J. ; Ma, C.F. ; Yuan, X.Y. ; Cai, D.Y.
Author_Institution
Dept. of Thermal Energy Eng., Beijing Polytech. Univ., China
Volume
19
Issue
2
fYear
1996
fDate
6/1/1996 12:00:00 AM
Firstpage
163
Lastpage
167
Abstract
This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas was obtained to correlate the experimental data for air cooling systems design. Arrays of components with one odd-sized module have also been tested. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared to uniform arrangements. Accordingly, temperature sensitive components are suggested to be placed in these locations
Keywords
arrays; cooling; forced convection; packaging; electronic component array; forced convective air cooling; heat transfer; inline protruding elements; modular configuration; packaging; parallel plate channel; splitter plate; temperature sensitive components; thermal management; Electronic components; Electronic equipment; Electronics cooling; Gallium nitride; Heat transfer; Packaging; Temperature sensors; Testing; Thermal conductivity; Thermal management;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.506100
Filename
506100
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