DocumentCode :
1045513
Title :
Low-Power Design and Temperature Management
Author :
Skadron, Kevin ; Bose, Pradip ; Ghose, Kanad ; Sendag, Resit ; Yi, Joshua J. ; Chiou, Derek
Author_Institution :
Virginia Univ., Charlottesville
Volume :
27
Issue :
6
fYear :
2007
Firstpage :
46
Lastpage :
57
Abstract :
One of the primary concerns for microprocessor designers has always been balancing power and thermal management while minimizing performance loss. rather than generate solutions to this dilemma, the advent of multicore chips has raised a host of new challenges. this discussion with Pradip Bose and Kanad Ghose, excerpted from a 2007 Card Workshop Panel, explores the future of low-power design and temperature management.
Keywords :
low-power electronics; microprocessor chips; thermal management (packaging); low-power design; microprocessor designer; multicore chip; temperature management; thermal management; Analytical models; Circuits; Energy management; Knowledge management; Microprocessors; Multicore processing; Performance loss; Power dissipation; Temperature control; Thermal management; energy-aware systems; hardware; low-power design; power management; temperature-aware design;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2007.104
Filename :
4437719
Link To Document :
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