DocumentCode :
104589
Title :
Application of graphite nanoplatelet-based and nanoparticle composites to thermal interface materials
Author :
Tien-Chan Chang ; Yiin-Kuen Fuh ; Sheng-Xun Tu ; Yueh-Mu Lee
Author_Institution :
Dept. of Nucl. Instrum., Inst. of Nucl. Energy Res., Taoyuan, Taiwan
Volume :
10
Issue :
6
fYear :
2015
fDate :
6 2015
Firstpage :
296
Lastpage :
301
Abstract :
Thermal interface materials (TIMs) are of crucial importance in improving and enhancing heat transfer in electronic packages, particularly in high-density electronics at regions of exceedingly high temperatures. Commercial TIMs are generally composed of highly conductive particle fillers such as highly thermally conductive graphite and a matrix so that efficient heat transfer and good compliance of the interface material can be achieved during application. Two types of TIMs are tested based on the hybridisation of graphite nanoplatelets (GNPs) and nanoparticles (NPs). The hybrid materials are fabricated via screen printing process to ensure conformal uniformity of NPs spreading on the GNPs. The performance of fabricated materials such as temperature, applied pressure, heat flux and TIM thickness are concurrently tested in the temperature range 40-80°C and the pressure range 0-5.6 kgf/cm2 using a standard TIM tester. The steady-state heat flow technique of American Society for Testing and Materials (ASTM) D5470-06 is fully adopted. For a thickness of 160 μm composite with three-layer GNPs and two-layer NPs, thermal conductivity is measured at ~0.2 W/m K. In addition, the measured trend in the change of specific thermal conductivity with pressure corresponds well with the data presented in the literature.
Keywords :
graphite; heat transfer; nanocomposites; nanoparticles; thermal conductivity; ASTM D5470-06; C; conformal uniformity; electronic packages; graphite nanoplatelet-based composites; heat transfer; hybridisation; nanoparticle composites; screen printing process; standard TIM tester; steady-state heat flow technique; temperature 40 degC to 80 degC; thermal conductivity; thermal interface materials;
fLanguage :
English
Journal_Title :
Micro & Nano Letters, IET
Publisher :
iet
ISSN :
1750-0443
Type :
jour
DOI :
10.1049/mnl.2014.0689
Filename :
7127183
Link To Document :
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