Title :
Low cost tightly keepered high density wire memory
Author :
Pohm, A.V. ; Boswell, R.R. ; Luckeroth, R.G.
Author_Institution :
Iowa State University, Ames, Iowa
fDate :
9/1/1971 12:00:00 AM
Keywords :
Plated-wire memories; Cable insulation; Copper; Costs; Ferrites; Integrated circuit packaging; Joining processes; Power supplies; Testing; Voltage; Wire;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.1971.1067105
