DocumentCode :
1046762
Title :
Correction to "Thermal Sensitivity Analysis for the 119 PBGA-A Framework for Rapid Prototyping"
Author :
Mulgaonker, S. ; Berg, H.M.
Volume :
19
Issue :
2
fYear :
1996
fDate :
6/1/1996 12:00:00 AM
Firstpage :
279
Keywords :
Conductivity measurement; Conductors; Ferroelectric films; Nonvolatile memory; Prototypes; Random access memory; Semiconductor device packaging; Sensitivity analysis; Substrates; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/TCPMA.1996.506116
Filename :
506116
Link To Document :
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