• DocumentCode
    1046762
  • Title

    Correction to "Thermal Sensitivity Analysis for the 119 PBGA-A Framework for Rapid Prototyping"

  • Author

    Mulgaonker, S. ; Berg, H.M.

  • Volume
    19
  • Issue
    2
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    279
  • Keywords
    Conductivity measurement; Conductors; Ferroelectric films; Nonvolatile memory; Prototypes; Random access memory; Semiconductor device packaging; Sensitivity analysis; Substrates; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/TCPMA.1996.506116
  • Filename
    506116
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1046762