DocumentCode
1046945
Title
SiC/Si heterojunction diodes fabricated by self-selective and by blanket rapid thermal chemical vapor deposition
Author
Yih, P.H. ; Li, J.P. ; Steckl, A.J.
Author_Institution
Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Volume
41
Issue
3
fYear
1994
fDate
3/1/1994 12:00:00 AM
Firstpage
281
Lastpage
287
Abstract
SiC/Si heterojunction diodes have been fabricated by two different rapid thermal chemical vapor deposition (RTCVD) processes: a localized self-selective growth and blanket growth. The self-selective growth of crystalline cubic (β) SiC was obtained by propane carbonization of the Si substrate in regions unprotected by an SiO2 layer, producing planar diodes. Mesa diodes were fabricated using the blanket growth of polycrystalline β-SiC produced by the decomposition of methylsilane (CH3SiH3). The SiC/Si heterojunction diodes show good rectifying properties for both device structures. Reverse breakdown voltage of 50 V was obtained with the self-selective SiC/Si diode. The mesa diodes exhibited even higher breakdown voltages (Vbr) of 150 V and excellent ideality factors of 1.06 at 25°C. The high Vbr and good forward rectifying characteristics indicate that the SiC/Si heterojunction diode represents a promising approach for the fabrication of wide-gap emitter SiC/Si heterojunction bipolar transistors
Keywords
chemical vapour deposition; electric breakdown of solids; elemental semiconductors; rapid thermal processing; semiconductor diodes; semiconductor materials; silicon; silicon compounds; solid-state rectifiers; 150 V; 50 V; CH3SiH3; RTCVD processes; Si; SiC-Si; SiO2; blanket growth; blanket rapid thermal CVD; chemical vapor deposition; crystalline cubic type; fabrication; heterojunction diodes; ideality factors; mesa diodes; methylsilane decomposition; planar diodes; polycrystalline β-SiC; propane carbonization; rectifying properties; reverse breakdown voltage; self-selective SiC/Si diode; self-selective growth; Chemical vapor deposition; Crystallization; Diodes; Fabrication; Heterojunctions; Rapid thermal processing; Semiconductor films; Silicon carbide; Substrates; Thermal conductivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.275210
Filename
275210
Link To Document