This paper investigated the coercive force (H
c) of laminated Co-P films. The films were laminated by introducing intermediate layers of Pd (

Å) or nonmagnetic Ni-P (T = 250 Å) between the Co-P films. The thickness of the Co-P films was varied from 650 Å to 2600 Å but was maintained constant within any series of laminations. The H
cwas evaluated as a function of total thickness for multiple Co-P laminate thicknesses up to 10,000 Å. The H
cof laminated Co-P films with intermediate Pd layers increased with total lamination thickness regardless of the thickness of the individual Co-P film. However, Co-P laminates deposited from a dilute solution with intermediate layers of Ni-P exhibited H
cvalues independent of the total lamination thickness. The H
cwas independent of the total lamination thickness regardless of the base material provided Ni-P was deposited as the substrate. The magnitude of the H
cwas dependent on the Co-P film thickness. The H
cof such Co-P laminates can be adjusted from 340 Oe to 700 Oe by selection of the appropriate thickness of the Co-P film. Co-P laminates deposited from a concentrated solution with intermediate layers of Ni-P exhibit H
cvalues which decrease with total lamination thickness. These films exhibited lower H
cvalues than nonlaminated Co-P films.