Title :
Refueling: Preventing Wire Degradation due to Electromigration
Author :
Abella, Jaume ; Vera, Xavier ; Unsal, Osman S. ; Ergin, Oguz ; Gonzalez, Adriana ; Tschanz, James W.
Abstract :
Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip´s most vulnerable wires. Refueling exploits EM´s self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire´s lifetime while reducing the chip area devoted to wires.
Keywords :
electromigration; failure analysis; bidirectional wires; electromigration; power/ground grids; refueling; self-healing effect; wire degradation; wire failure; Current density; Degradation; Electromigration; Frequency; Integrated circuit interconnections; Process design; Temperature; Transistors; Voltage; Wire;
Journal_Title :
Micro, IEEE
