• DocumentCode
    1051073
  • Title

    Reduction of popcorn noise in integrated circuits

  • Author

    Roedel, R. ; Viswanathan, C.R.

  • Author_Institution
    University of California, Los Angeles, Calif.
  • Volume
    22
  • Issue
    10
  • fYear
    1975
  • fDate
    10/1/1975 12:00:00 AM
  • Firstpage
    962
  • Lastpage
    964
  • Abstract
    Popcorn (burst) noise continues to deteriorate the operation of linear IC devices. Reduction of popcorn noise by a few simple modifications in the manufacturing process is reported in this paper. Annealing in an HC1 atmosphere to getter metal impurities and slow pulling after emitter deposition to diminish stress-induced junction defects appear to reduce the popcorn noise significantly.
  • Keywords
    Annealing; Capacitance; Etching; FETs; Glass; Integrated circuit noise; Low-frequency noise; Noise reduction; Personal communication networks; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1975.18251
  • Filename
    1478086
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1051073