Title :
Reduction of popcorn noise in integrated circuits
Author :
Roedel, R. ; Viswanathan, C.R.
Author_Institution :
University of California, Los Angeles, Calif.
fDate :
10/1/1975 12:00:00 AM
Abstract :
Popcorn (burst) noise continues to deteriorate the operation of linear IC devices. Reduction of popcorn noise by a few simple modifications in the manufacturing process is reported in this paper. Annealing in an HC1 atmosphere to getter metal impurities and slow pulling after emitter deposition to diminish stress-induced junction defects appear to reduce the popcorn noise significantly.
Keywords :
Annealing; Capacitance; Etching; FETs; Glass; Integrated circuit noise; Low-frequency noise; Noise reduction; Personal communication networks; Threshold voltage;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1975.18251
