DocumentCode :
1052309
Title :
Resonant silicon accelerometers in bulk micromachining technology-an approach
Author :
Burrer, Christian ; Esteve, Jaume ; Lora-Tamayo, Emilio
Author_Institution :
Centre Nacional de Microelectron., CSIC, Barcelona, Spain
Volume :
5
Issue :
2
fYear :
1996
fDate :
6/1/1996 12:00:00 AM
Firstpage :
122
Lastpage :
130
Abstract :
The fabrication and characterization of resonant silicon accelerometers, made in bulk micromachining technology, is presented. The devices consist of a silicon mass, coupled axially to a strain-sensitive vibrating silicon beam. The beam is driven electrothermally and sensed piezoresistively by means of implanted piezoresistors. Two different accelerometer types are shown, differing in the complexity of the respective fabrication processes and in performances. Closed-loop operation of the devices is demonstrated. Also in the closed loop, static and dynamic measurements of prototypes have been performed. The sensor types presented are compared, and the resonant acceleration sensor concept is discussed
Keywords :
accelerometers; elemental semiconductors; etching; micromechanical resonators; microsensors; piezoresistive devices; semiconductor technology; silicon; silicon-on-insulator; wafer bonding; BESOI; Si; Si mass; Si resonant accelerometers; bond and etch back SOI; bulk micromachining technology; closed-loop operation; dynamic measurements; implanted piezoresistors; resonant acceleration sensor; static measurements; Accelerometers; Electrothermal effects; Fabrication; Micromachining; Optical coupling; Piezoresistance; Piezoresistive devices; Prototypes; Resonance; Silicon;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.506200
Filename :
506200
Link To Document :
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