• DocumentCode
    1053951
  • Title

    Introduction to the Special Issue on Failure Analysis of Integrated Circuit Devices and Packages

  • Author

    Goyal, Deepak

  • Volume
    7
  • Issue
    1
  • fYear
    2007
  • fDate
    3/1/2007 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    4
  • Abstract
    The four articles in this special issue focus on failure analysis of integrated circuit devices and packages. The articles are briefly summarized here.
  • Keywords
    Chip scale packaging; Communication switching; Dielectric materials; Failure analysis; Integrated circuit interconnections; Integrated circuit packaging; Optical switches; Scanning electron microscopy; Special issues and sections; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2007.900059
  • Filename
    4271489
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1053951