DocumentCode
1053962
Title
Introduction to the Special Issue on the 2006 International Reliability Physics Symposium
Author
Suehle, J. S. ; Cheung, K. P. ; Spinelli, Almir
Volume
7
Issue
1
fYear
2007
fDate
3/1/2007 12:00:00 AM
Firstpage
50
Lastpage
50
Abstract
The 12 papers in this special issue are extensions of presentations given at the 44th Annual IEEE International Reliability Physics Symposium (IRPS), held in San Jose, CA, on March 26-30, 2006. The diverse set of papers include studies in assembly and packaging reliability, interconnect reliability, latchup, product reliability, soft error rate, memory reliability, process-induced damage, and transistor reliability. The papers are briefly summarized here.
Keywords
Assembly; Dielectrics; Error analysis; Materials reliability; Niobium compounds; Packaging; Physics; Semiconductor device modeling; Special issues and sections; Titanium compounds;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2007.901137
Filename
4271490
Link To Document