Title :
Integration of fluidically self-assembled optoelectronic devices using a silicon-based process
Author :
Talghader, Joseph J. ; Tu, Jay K. ; Smith, J. Stephen
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
Fluidic self-assembly (FSA) is a technique for efficient wafer-scale placement of large numbers of small or microscopic devices into receptor sites etched in a substrate. This paper reports the first complete planar process for integrating optoelectronic devices on a silicon wafer using fluidic self-assembly. Methods for bonding the devices into the receptor sites and subsequently contacting, planarizing, and interconnecting them are outlined.<>
Keywords :
etching; integrated optoelectronics; optical fabrication; optical interconnections; optoelectronic devices; bonding; contacting; etched; fluidically self-assembled optoelectronic devices; interconnecting; microscopic devices; optoelectronic device integration; planar process; planarizing; receptor sites; silicon wafer; silicon-based process; substrate; wafer-scale placement; Assembly; Bonding; Etching; Gallium arsenide; Optical microscopy; Optoelectronic devices; Self-assembly; Silicon; Substrates; Vertical cavity surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE
