• DocumentCode
    1054541
  • Title

    High performance torsional silicon accelerometer for automotive air bags

  • Author

    Seok, Seonho ; Lee, Byeungleul ; Chun, Kulkjin

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
  • Volume
    38
  • Issue
    23
  • fYear
    2002
  • fDate
    11/7/2002 12:00:00 AM
  • Firstpage
    1435
  • Lastpage
    1437
  • Abstract
    A high-sensitivity torsional silicon accelerometer for automotive air bag systems has been developed using wet etching of single crystal silicon and a silicon-glass bonding technique. The fabricated accelerometer yields a sensitivity of 100 mV/G, and a nonlinearity of 1.13% over a range of -22 G to 22 G. The minimum detectable acceleration measured by the readout electronics is 25 mG.
  • Keywords
    accelerometers; automotive electronics; elemental semiconductors; etching; microsensors; readout electronics; silicon; wafer bonding; Si; accelerometer nonlinearity; accelerometer sensitivity; automotive air bag systems; high-sensitivity torsional silicon accelerometer; microaccelerometers; minimum detectable acceleration; readout electronics; silicon-glass bonding technique; single crystal silicon; wet etching;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20020986
  • Filename
    1068025