Title :
High performance torsional silicon accelerometer for automotive air bags
Author :
Seok, Seonho ; Lee, Byeungleul ; Chun, Kulkjin
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
fDate :
11/7/2002 12:00:00 AM
Abstract :
A high-sensitivity torsional silicon accelerometer for automotive air bag systems has been developed using wet etching of single crystal silicon and a silicon-glass bonding technique. The fabricated accelerometer yields a sensitivity of 100 mV/G, and a nonlinearity of 1.13% over a range of -22 G to 22 G. The minimum detectable acceleration measured by the readout electronics is 25 mG.
Keywords :
accelerometers; automotive electronics; elemental semiconductors; etching; microsensors; readout electronics; silicon; wafer bonding; Si; accelerometer nonlinearity; accelerometer sensitivity; automotive air bag systems; high-sensitivity torsional silicon accelerometer; microaccelerometers; minimum detectable acceleration; readout electronics; silicon-glass bonding technique; single crystal silicon; wet etching;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020986