• DocumentCode
    1054622
  • Title

    Improvement of mini-fab uptime by using multitask and multifunctional tools

  • Author

    Mikata, Yuuichi ; Tanimoto, Keisuke ; Ishii, Ken ; Oka, Shinsuke

  • Author_Institution
    HALCA Project, Assoc. of Super-Adv. Electron. Technol. (ASET), Ibaraki, Japan
  • Volume
    17
  • Issue
    3
  • fYear
    2004
  • Firstpage
    273
  • Lastpage
    280
  • Abstract
    Multitask and multifunctional tools can process alternative operations, for example, LPCVD depositions of both Poly Si and SiN films with good repeatability and few particulates. Using those tools, we can reduce the total number of tools and the number of "only-one" tools which exist for a type of tool in the fab. We have also evaluated mini-fab availabilities using both a full calculation method and an approximate calculation method. The results show that tool reduction is more effective in obtaining good fab availability and uptime. The reduction of "only-one" tools is very important to improving mini-fab availability. The approximate calculation is simple for estimating the fab availability and offers the possibility to extend mega-fab estimations. It is also possible to use in the case that there are variations of MTTR, MTBF, and excess tool numbers.
  • Keywords
    chemical vapour deposition; cost reduction; elemental semiconductors; semiconductor growth; semiconductor process modelling; semiconductor thin films; silicon; silicon compounds; LPCVD depositions; Si; SiN; SiN films; approximate calculation method; multifunctional tools; multitask tools; poly Si film; tool reduction; Costs; Flexible manufacturing systems; Furnaces; Logic; Oxidation; Production; Productivity; Semiconductor films; Silicon compounds; Throughput; Agile-fab; LPCVD; MTBF; MTTR; Poly Si; SiN; SoC; alternative operation; availability; downtime; mini-fab; model; multifunctional; multitask; only-one tool; uptime;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2004.831933
  • Filename
    1321122