Title :
300-mm full-factory Simulations for 90- and 65-nm IC manufacturing
Author :
Pillai, Devadas D. ; Bass, Edward L. ; Dempsey, James C. ; Yellig, Edward J.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
We present enabling capabilities and key results realized by the development and implementation of 300-mm full-factory simulation tools supporting Intel´s 90-nm high-volume manufacturing and 65-nm technology development factories. We discuss key attributes of these simulators which are being utilized for strategic fab capacity planning, automation systems designs, and tactical manufacturing execution and decision support for continuous improvement. These simulators capture the dynamic behaviors of hundreds of production tools with thousands of production and engineering lots and integrate automated material handling systems (AMHS) behaviors in these production simulations. The paper discusses specific topical areas where these tools have found widespread use and emphasizes the importance of periodic model validation and calibration to the real factory.
Keywords :
capacity planning (manufacturing); electronics industry; integrated circuit manufacture; integrated circuit modelling; 300 mm full factory simulations; 65 nm; 90 nm; IC manufacturing; Intel; automated material handling systems; automation systems designs; calibration; engineering lots; full factory simulation tools; periodic model validation; production lots; production simulations; production tools; strategic fab capacity planning; tactical manufacturing execution; Analytical models; Capacity planning; Manufacturing automation; Materials handling; Production facilities; Production systems; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing; 00-mm wafer manufacturing; AMHS; Automated material handling systems; fabrication simulation; full-factory modeling; high mix; high-volume manufacturing; sensitivity analysis; simulation; technology development;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2004.831930