DocumentCode :
1054948
Title :
Algorithms for simulation of three-dimensional etching
Author :
Toh, Kenny K H ; Neureuther, Andrew R. ; Scheckler, Edward W.
Author_Institution :
Electron. Res. Lab., California Univ., Berkeley, CA, USA
Volume :
13
Issue :
5
fYear :
1994
fDate :
5/1/1994 12:00:00 AM
Firstpage :
616
Lastpage :
624
Abstract :
A three-dimensional optical lithography simulator has been developed based on a new ray-string algorithm for dissolution etch-front advancement. In developing the new algorithm, performance studies of cell, string and ray algorithms were carried out in two dimensions. A key finding was that a recursive ray method for the calculation of the surface-advancement vector produced numerically stable and highly accurate results. The optimum algorithm was found to be one that combines the recursive-ray method with the string approach, in which etch-rate-dependent rays are used to advance the points, segments and triangles which make up the etching boundary. This algorithm has been implemented in 3-D in the C programming language, using a linked-list data structure to represent the etching boundary mesh. Recursive time-step selection, mesh modification, and clipping and delooping of the etch boundary surface have been implemented. The 3-D ray-string etch simulator has been coupled to 2-D imaging and 3-D resist-exposure simulators to form SAMPLE-3D, a complete fast and accurate 3-D photolithography simulator. The complete simulator has been used to investigate various issues in 3-D lithographic pattern transfer
Keywords :
digital simulation; electronic engineering computing; etching; photolithography; semiconductor process modelling; 3D optical lithography simulator; 3D photolithography simulator; C programming language; SAMPLE-3D; dissolution etch-front advancement; etching boundary mesh; linked-list data structure; lithographic pattern transfer; mesh modification; optimum algorithm; ray-string algorithm; recursive ray method; surface-advancement vector; three-dimensional etching simulation; time-step selection; Circuit simulation; Computational modeling; Computer languages; Data structures; Etching; Helium; Integrated circuit technology; Laboratories; Lithography; Optical imaging;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.277635
Filename :
277635
Link To Document :
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