DocumentCode
1056122
Title
Electronic processes at grain boundaries in polycrystalline semiconductors under optical illumination
Author
Card, Howard C. ; Yang, Edward S.
Author_Institution
Columbia University, New York, NY
Volume
24
Issue
4
fYear
1977
fDate
4/1/1977 12:00:00 AM
Firstpage
397
Lastpage
402
Abstract
The dependence of minority carrier lifetime (τ) on the doping concentration Nd , grain size
and interface state density Nis at the grain boundaries in (n-type) polycrystalline semiconductors has been calculated analytically. The recombination velocity at grain boundaries is enhanced by the diffusion potential Vd adjacent to the boundaries, and ranges from
to 106cm . s-1depending on Nis and Nd . Under illumination, the population of the interface states is altered considerably from its dark level and as a result, Vd decreases to that value which maximizes recombination (equal concentrations of electrons and holes at the boundary). This causes τ to decrease with increasing Nd . Sample calculations for polycrystalline silicon show that for low angle boundaries with interface state densities of
cm-2eV-1, τ decreases from 10-6to 10-10s as the grain size is reduced from 1000 to 0.1 µm (for
cm-3). For a constant grain size, τ decreases with increasing Nd . The open-circuit voltage of p-n junction solar cells decreases for
s, whereas that for Schottky barrier cells remains at its maximum value until
s.
and interface state density N
to 106cm . s-1depending on N
cm-2eV-1, τ decreases from 10-6to 10-10s as the grain size is reduced from 1000 to 0.1 µm (for
cm-3). For a constant grain size, τ decreases with increasing N
s, whereas that for Schottky barrier cells remains at its maximum value until
s.Keywords
Charge carrier lifetime; Charge carrier processes; Grain boundaries; Grain size; Interface states; Lighting; Radiative recombination; Semiconductor device doping; Silicon; Spontaneous emission;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1977.18747
Filename
1478939
Link To Document