• DocumentCode
    1056281
  • Title

    On the effect of defect clustering on test transparency and IC test optimization

  • Author

    Singh, A.D. ; Krishna, C.M.

  • Author_Institution
    Dept. of Electr. Eng., Auburn Univ., AL, USA
  • Volume
    45
  • Issue
    6
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    753
  • Lastpage
    757
  • Abstract
    We recently proposed a wafer-based testing approach which for the first time employs defect clustering information on the wafer to optimize test cost and defect levels in the shipped product. Preliminary analysis of this approach had implicitly assumed that the probability that a test detects a faulty circuit is independent of the number of faults in that circuit. This assumption may be optimistic. In this correspondence, we study the effect of clustering and test transparency on defect distributions in individual dice, and its impact on the fault detection capabilities of a given test set. We show here that significant defect-level improvements in the shipped product can indeed be achieved by exploiting defect clustering in optimization testing
  • Keywords
    VLSI; circuit optimisation; integrated circuit testing; integrated circuit yield; IC test optimization; defect clustering; defect levels; fault detection capabilities; faulty circuit; individual dice; optimization testing; test set; test transparency; wafer-based testing approach; Circuit faults; Circuit testing; Cost function; Electrical fault detection; Failure analysis; Fault detection; Integrated circuit testing; Integrated circuit yield; Timing; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Computers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9340
  • Type

    jour

  • DOI
    10.1109/12.506431
  • Filename
    506431