The junction and insulated gate FET (JIGFET) is a novel type of JFET which is formed by implantation of a deep channel between source and drain through a MOST gate. For high voltages on the gate an inversion layer is created underneath the oxide. This inversion layer is laterally connected to the substrate. In this way a new channel control mechanism for FET\´s is achieved in which the inversion layer is used as a substitute for a p
+-n- or an n
+-p-junction. This results in a very high bulk transconductance, which is of considerable importance in many applications. In this paper the n-channel JIGFET\´s with implanted channels of 2.4 × 10
12p
+ions/cm
2at 100 keV and 3.4 × 10
12p+ ions/cm
2at 160 keV are investigated. The implantation profiles are calculated from pulsed

measurements. From these data the dc characteristics are calculated with the abrupt space charge layer edge (ASCE) approximation and compared with the experiments for both high and low drain voltages.