Title :
Lumped-distributed hybrids in 3D-MMIC technology
Author :
Ng, C.Y. ; Chongcheawchamnan, M. ; Robertson, I.D.
Author_Institution :
Sch. of Electron. & Phys. Sci., Univ. of Surrey, Guildford, UK
Abstract :
A multilayer branch-line coupler, rat-race hybrid and Wilkinson power divider are presented using 3D-MMIC technology with multiple BCB and metal layers on a GaAs substrate. The circuits are designed to operate in X-band and by using the lumped-distributed approach, together with highly miniaturised TFMS lines, these multilayer circuits have achieved as much as ten times size reduction in comparison to their conventional distributed form in microstrip. Techniques for compensating the unequal parasitic capacitance in asymmetrical MIM structures are described.
Keywords :
MMIC; lumped parameter networks; microstrip couplers; power dividers; 3D-MMIC technology; 8 to 12 GHz; GaAs; GaAs substrate; Wilkinson power divider; X-band; asymmetrical MIM structure; lumped-distributed hybrid; miniaturised TFMS line; multilayer branch-line coupler; multilayer circuit; multiple BCB metal layer; parasitic capacitance; rat-race hybrid;
Journal_Title :
Microwaves, Antennas and Propagation, IEE Proceedings
DOI :
10.1049/ip-map:20040656
