Title :
The effects of chemical structure on the dielectric properties of polyetherimide and nanocomposites
Author :
Chen, Bor-Kuan ; Du, J.-U. ; Hou, C.-W.
Author_Institution :
Kun Shan Univ., Tainan
fDate :
2/1/2008 12:00:00 AM
Abstract :
Low dielectric constant polyetherimides have been synthesized by incorporating a bisphenol A dianhydride, BPADA, and 2,7-bis(4-aminophenoxy) naphthalene (BAPN), a phenylene ether diamine. The flexible ether and larger planar naphthalene structure of BAPN led to more spacing between polymer molecules, resulting in less efficient chain packing and an increase in the free volume, thus decreasing the dielectric constant. New PEI/silica hybrid nanocomposites were prepared from this novel polyetherimide via sol-gel process. The dielectric constants were further decreased with the incorporation of silica. These synthesized PEI and nanocomposites have high thermal stability and good mechanical properties.
Keywords :
chemical structure; fracture; nanocomposites; organic-inorganic hybrid materials; permittivity; polymers; silicon compounds; thermal stability; 2,7-bis(4-aminophenoxy) naphthalene; SiO2; bisphenol A dianhydride; chain packing; chemical structure; dielectric constant; dielectric properties; fracture; hybrid nanocomposites; mechanical properties; phenylene ether diamine; polyetherimide; sol-gel process; thermal stability; Chemicals; Dielectric constant; Dielectric materials; Mechanical factors; Microelectronics; Nanocomposites; Polyimides; Silicon compounds; Solvents; Thermal stability;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/T-DEI.2008.4446743