DocumentCode :
1060070
Title :
On the compatibility of X-ray lithography and SOS device fabrication
Author :
Galloway, K.F. ; Mayo, S.
Author_Institution :
National Bureau of Standards,Washington, DC
Volume :
25
Issue :
5
fYear :
1978
fDate :
5/1/1978 12:00:00 AM
Firstpage :
549
Lastpage :
550
Abstract :
If X-ray lithography is applied to the fabrication of silicon-on-sapphire devices (SOS), the average radiation absorbed dose in the sapphire at the silicon-sapphire interface is in excess of ten Mrad. Recent experiments indicate that the resulting radiation damage may not be easily annealed. These results suggest that X-ray lithography and SOS may not be compatible technologies.
Keywords :
Aluminum; Annealing; Electromagnetic wave absorption; Fabrication; Leakage current; Metallization; Radiation dosage; Resists; Silicon; X-ray lithography;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1978.19129
Filename :
1479523
Link To Document :
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