• DocumentCode
    1060681
  • Title

    Foreword Wafer Level Packaging: More of Many

  • Author

    Nguyen, L. T.

  • Volume
    31
  • Issue
    1
  • fYear
    2008
  • Firstpage
    2
  • Lastpage
    3
  • Abstract
    The five papers in this special section focus on wafer level packaging.
  • Keywords
    Components, Packaging, and Manufacturing Technology Society; Electronics packaging; Environmentally friendly manufacturing techniques; Image sensors; Integrated circuit interconnections; Optical sensors; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Thermal management; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2008.917824
  • Filename
    4447323
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1060681