DocumentCode
1060712
Title
A new horizontal thin film head
Author
Umesaki, M. ; Ohdoi, Y. ; Hata, H. ; Yabushita, K. ; Morikawa, K. ; Kishi, H. ; Horibata, S. ; Shibata, H.
Author_Institution
Mitsubishi Electr. Corp., Hyogo, Japan
Volume
27
Issue
6
fYear
1991
fDate
11/1/1991 12:00:00 AM
Firstpage
4933
Lastpage
4935
Abstract
The authors have developed a novel horizontal thin film head which has a desirable core structure near the gap. The via holes of the substrate were filled with conductive paste to make electrical connections. The gap was formed on the sidewall of the half core by sputtering. The output waveform had little undershoot, and periodic ripples in the roll-off curve were reduced. With a 5-μm track width head, a signal-to-noise ratio of 25 dB at 40 kBPI was obtained
Keywords
magnetic heads; magnetic thin film devices; 25 dB; conductive paste; horizontal thin film head; reduced roll-off curve ripples; signal-to-noise ratio; substrate; via holes; Coils; Conducting materials; Crystallization; Insulation; Laboratories; Magnetic heads; Protection; Sputtering; Substrates; Transistors;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.278701
Filename
278701
Link To Document