• DocumentCode
    1060780
  • Title

    LF55GN Photosensitive Flexopolymer: A New Material for Ultrathick and High-Aspect-Ratio MEMS Fabrication

  • Author

    Sayah, Abdeljalil ; Parashar, Virendra K. ; Gijs, Martin A M

  • Author_Institution
    Swiss Fed. Inst. of Technol. Lausanne, Lausanne
  • Volume
    16
  • Issue
    3
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    564
  • Lastpage
    570
  • Abstract
    A growing interest in the development of thick functional structures with high aspect ratio for microelectromechanical system (MEMS) applications has triggered the investigation of several polymer materials. This paper presents LF55GN flexopolymer material as a new negative-tone photoresist to fabricate ultrathick MEMS microstructures. Up to 4-mm-thick layers are obtained using a casting method in a single photolithography step. Standard UV illumination is used to polymerize such thick microstructures in less than 1 min and with an aspect ratio up to 27. We have fabricated microstructures on rigid, flexible, and stepped substrates. Using oblique UV exposure, tilted pillars are achieved with an angle of 25deg to the substrate normal. Due to the elastomeric nature of the LF55GN flexopolymer, the microstructures can be easily deformed without causing any stress-related problems.
  • Keywords
    casting; micromachining; micromechanical devices; photoresists; polymers; LF55GN photosensitive flexopolymer; UV illumination; casting method; flexible substrates; high-aspect-ratio MEMS fabrication; microelectromechanical system; negative-tone photoresist; oblique UV exposure; photolithography; polymer materials; rigid substrates; stepped substrates; thick functional structures; ultrathick MEMS microstructures; Adhesives; Casting; Fabrication; Microelectromechanical systems; Micromechanical devices; Microstructure; Optical films; Polymers; Resists; Thermal stresses; Casting; LF55GN; flexopolymer; high aspect ratio; microfabrication;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2007.896705
  • Filename
    4276818