DocumentCode
1060996
Title
Structure and High-Field Performance of New 
Wires Fabricated From Sn-Based Alloys
Author
Tachikawa, Kyoji ; Hayashi, Yuuki ; Nakata, Koei ; Sasaki, Hiroki ; Yamaguchi, Masahiro ; Takeuchi, Takao
Author_Institution
Fac. of Eng., Tokai Univ., Hiratsuka, Japan
Volume
19
Issue
3
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
2584
Lastpage
2587
Abstract
Sn-Ta based quaternary alloys were prepared by the reaction of constituent metal powders. The alloys were fabricated into sheet or rod forms. In addition, Sn-Ti based ternary alloys prepared by melt and cast procedure were fabricated into sheets. Jelly Roll (JR) composites were prepared using Sn-based alloy sheet and Nb sheet, and then fabricated into wires. A Bc2 (4.2 K) of 26.9 T (mid) has been obtained in the JR wire using Sn-Ta based alloy sheet. Thick Nb3Sn layers were formed by the mutual diffusion between Sn-based alloy sheet and Nb sheet. Stoichiometric Sn concentration with no gradient was obtained throughout the Nb3Sn layers, which may be the main origin of excellent high-field performance of the JR wires. Meanwhile, 19 and 37 filamentary Nb3Sn wires have been fabricated using Sn-Ta based alloy rods. An equivalent high-field performance has been obtained in the multi-rod wires as that of JR wires.
Keywords
casting; chemical interdiffusion; composite materials; melt processing; niobium alloys; rods (structures); sheet materials; stoichiometry; superconducting critical field; tantalum alloys; tin alloys; titanium alloys; type II superconductors; JR wires; Nb3Sn; Sn-Ta based quaternary alloys; SnTaJk; SnTiJk; alloy rods; casting; diffusion; filamentary wires; high-field performance; jelly roll composites; magnetic flux density 26.9 T; melt process; multirod wires; stoichiometry; superconducting wires; temperature 4.2 K; ternary alloy sheets; ${hbox {Nb}}_{3}{hbox {Sn}}$ wire; Diffusion mechanism; Sn based alloys; high-field performance; jelly roll process; multi-rod process;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2009.2018076
Filename
5067211
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