Title :
Survey on Symplectic Finite-Difference Time-Domain Schemes for Maxwell´s Equations
Author :
Sha, Wei ; Huang, Zhixiang ; Chen, Mingsheng ; Wu, Xianliang
Author_Institution :
Anhui Univ., Hefei
Abstract :
To discretize Maxwell´s equations, a variety of high-order symplectic finite-difference time-domain schemes, which use th-order symplectic integration time stepping and th-order staggered space differencing, are surveyed. First, the order conditions for the symplectic integrators are derived. Second, the comparisons of numerical stability, dispersion, and energy-conservation are provided between the high-order symplectic schemes and other high-order time approaches. Finally, these symplectic schemes are studied by using different space and time strategies. According to our survey, high-order time schemes for matching high-order space schemes are required for optimum electromagnetic simulation. Numerical experiments have been conducted on radiation of electric dipole and wideband S-parameter extraction of dielectric-filled waveguide. The results demonstrate that the high-order symplectic scheme can obtain satisfying numerical solutions under high Courant-Friedrichs-Levy number and coarse grid conditions.
Keywords :
Maxwell equations; computational electromagnetics; dielectric-loaded waveguides; finite difference time-domain analysis; numerical stability; Courant-Friedrichs-Levy number; Maxwell´s equation; S-parameter extraction; dielectric-filled waveguide; electric dipole; electromagnetic simulation; numerical stability; staggered space differencing; symplectic finite-difference time-domain scheme; symplectic integration time stepping; Computational complexity; Computational modeling; Difference equations; Electromagnetic radiation; Finite difference methods; Lattices; Maxwell equations; Numerical stability; Signal processing algorithms; Time domain analysis; High-order differences; Maxwell´s equations; numerical stability and dispersion; symplectic integrators;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2007.915444